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Home > Technology > Besi orders more than double as AI and hybrid bonding tech drive demand

Besi orders more than double as AI and hybrid bonding tech drive demand

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Published: July 23, 2026 12:33:06 IST

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July 23 (Reuters) – BE Semiconductor Industries (Besi) on Thursday reported quarterly orders significantly above last year's level, fuelled by strong demand for AI, hybrid bonding, photonics and data

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