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Cadence rolls out AI agent to speed circuit board, chip packaging design

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Published: July 16, 2026 04:02:10 IST

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By Stephen Nellis SAN FRANCISCO, July 15 (Reuters) – Cadence Design Systems on Wednesday launched an artificial-intelligence "super agent" that designs  printed circuit boards and chip packages,

(The article has been published through a syndicated feed. Except for the headline, the content has been published verbatim. Liability lies with original publisher.)

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