Sergio Gor lauds JSW Steel's USD 500 million investments in US
New Delhi [India], June 30 (ANI): US Ambassador to India Sergio Gor lauded JSW Steel's USD 500 million investment in…
TSMC, Amkor sign 10-year deal to boost advanced chip packaging in US
Taipei [Taiwan], June 18 (ANI): Taiwan Semiconductor Manufacturing Co (TSMC) and US-based chip packaging and testing provider Amkor Technology have…