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Home > Technology > AI boom turns chip packaging into the next battleground for semiconductors

AI boom turns chip packaging into the next battleground for semiconductors

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Published: November 6, 2026 11:59:06 IST

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By Wen-Yee Lee TAIPEI, Nov 6 (Reuters) – A global race to build AI infrastructure is unleashing billions of dollars of investment in advanced chip packaging, a once unglamorous aspect of technology

(The article has been published through a syndicated feed. Except for the headline, the content has been published verbatim. Liability lies with original publisher.)

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