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Home > Technology > SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility

SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility

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Published: August 27, 2026 19:50:08 IST

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By Kenrick Cai and Heekyong Yang WEST LAFAYETTE, Indiana, Aug 27 (Reuters) – South Korean chipmaker SK Hynix on Thursday held a groundbreaking ceremony for an advanced packaging and research facility

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